We are including links to download the available presentations from our meetings

Presentation:

Topic: S-parameter Modeling for Signal and Power Distribution System Analysis ( Download )
Invited Speaker:   Sam Chitwood, Manager, Field Applications Engineering Sigrity Inc

Topic: Packaging Effects on Mechanical Reliability of Cu/low k Interconnects ( Download ). Invited Speaker: Dr. Paul S. Ho, Director of the Laboratory for Interconnects and Packaging at The University of Texas at Austin

Topic: Power Multichip Module Packaging and  its Impact on Server Architecture and Operating Systems (Download).  Invited Speaker:  Dr. Hubert Harrer, IBM Server and Technology Group, Boeblingen, Germany 

Topic: Power Integrity Modeling and Design for Semiconductor and Systems (Download)
Invited Speaker:   Dr. Madhavan Swaminathan, Deputy Director, Microsystems Packaging Research Center, Georgia Institute of Technology, Atlanta    

Topic: 'Signal and Power Integrity Design of Packages for High-End ASICs'  (Download)
Invited Speaker: Dr. Brian Young, Design Packaging Manager, ASIC Group, TI

Topic: Advanced Packaging Review: SiP.'  (Download) 
Invited Speaker: Dr. E. Jan Vardaman, President and Founder of TechSearch International Inc.